ESD5V3U1U Series
Revision History
Page or Item
Subjects (major changes since previous revision)
Revision 1.0, 2011-05-27
Trademarks of Infineon Technologies AG
AURIX?, BlueMoon?, COMNEON?, C166?, CROSSAVE?, CanPAK?, CIPOS?, CoolMOS?, CoolSET?,
CORECONTROL?, DAVE?, EasyPIM?, EconoBRIDGE?, EconoDUAL?, EconoPACK?, EconoPIM?,
EiceDRIVER?, EUPEC?, FCOS?, HITFET?, HybridPACK?, ISOFACE?, I2RF?, IsoPACK?, MIPAQ?,
ModSTACK?, my-d?, NovalithIC?, OmniTune?, OptiMOS?, ORIGA?, PROFET?, PRO-SIL?,
PRIMARION?, PrimePACK?, RASIC?, ReverSave?, SatRIC?, SIEGET?, SINDRION?, SMARTi?,
SmartLEWIS?, TEMPFET?, thinQ!?, TriCore?, TRENCHSTOP?, X-GOLD?, XMM?, X-PMU?,
XPOSYS?.
Other Trademarks
Advance Design System? (ADS) of Agilent Technologies, AMBA?, ARM?, MULTI-ICE?, PRIMECELL?,
REALVIEW?, THUMB? of ARM Limited, UK. AUTOSAR? is licensed by AUTOSAR development partnership.
Bluetooth? of Bluetooth SIG Inc. CAT-iq? of DECT Forum. COLOSSUS?, FirstGPS? of Trimble Navigation
Ltd. EMV? of EMVCo, LLC (Visa Holdings Inc.). EPCOS? of Epcos AG. FLEXGO? of Microsoft Corporation.
FlexRay? is licensed by FlexRay Consortium. HYPERTERMINAL? of Hilgraeve Incorporated. IEC? of
Commission Electrotechnique Internationale. IrDA? of Infrared Data Association Corporation. ISO? of
INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB? of MathWorks, Inc. MAXIM? of
Maxim Integrated Products, Inc. MICROTEC?, NUCLEUS? of Mentor Graphics Corporation. Mifare? of NXP.
MIPI? of MIPI Alliance, Inc. MIPS? of MIPS Technologies, Inc., USA. muRata? of MURATA
MANUFACTURING CO., MICROWAVE OFFICE? (MWO) of Applied Wave Research Inc., OmniVision? of
OmniVision Technologies, Inc. Openwave? Openwave Systems Inc. RED HAT? Red Hat, Inc. RFMD? RF
Micro Devices, Inc. SIRIUS? of Sirius Sattelite Radio Inc. SOLARIS? of Sun Microsystems, Inc. SPANSION?
of Spansion LLC Ltd. Symbian? of Symbian Software Limited. TAIYO YUDEN? of Taiyo Yuden Co.
TEAKLITE? of CEVA, Inc. TEKTRONIX? of Tektronix Inc. TOKO? of TOKO KABUSHIKI KAISHA TA. UNIX?
of X/Open Company Limited. VERILOG?, PALLADIUM? of Cadence Design Systems, Inc. VLYNQ? of Texas
Instruments Incorporated. VXWORKS?, WIND RIVER? of WIND RIVER SYSTEMS, INC. ZETEX? of Diodes
Zetex Limited.
Last Trademarks Update 2010-06-09
Final Data Sheet
3
Revision 1.0, 2011-05-27
相关PDF资料
ESD5V3U2U-03LRH E6327 DIODE ESD ARRAY 5.3V TSLP-3-7
ESD5V3U4U-HDMI E6327 DIODE ESD ARRAY 5.3V TSLP-9
ESD5V5U5ULC E6327 DIODE TVS UNIDIR 5.5V SC74-6
ESD5Z7.0T1 TVS ESD ASD 200W 7.0V SOD-523
ESD6100 TVS DIODE 5.5V 2CH BI 4-WLCSP
ESD6116 IC TVS 1CH 16V 4-WLCSP
ESD7004MUTAG IC ESD PROT LOW CAP 10UDFN
ESD7008MUTAG IC DIODE LOW CAP ESD 18UDFN
相关代理商/技术参数
ESD5V3U1U-02LSE6327 制造商:Infineon Technologies AG 功能描述:
ESD5V3U1U02LSE6327XTSA1 制造商:Infineon Technologies AG 功能描述:ESD Suppressor TVS 20KV 2-Pin TSSLP 制造商:Infineon Technologies AG 功能描述:TVS DIODES - Tape and Reel 制造商:Infineon Technologies AG 功能描述:DIODE TVS 5.3V TSSLP-2-1
ESD5V3U2U 制造商:INFINEON 制造商全称:Infineon Technologies AG 功能描述:Ultra-Low Capacitance ESD Diode Array
ESD5V3U2U-03F 制造商:INFINEON 制造商全称:Infineon Technologies AG 功能描述:Ultra-Low Capacitance ESD Diode Array
ESD5V3U2U-03F E6327 功能描述:TVS二极管阵列 Ultra Low Capac. 5.3 V RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C
ESD5V3U2U-03F H6327 功能描述:TVS二极管阵列 AF SCHOTTKY DIODE RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C
ESD5V3U2U03FH6327XTSA1 制造商:Infineon Technologies AG 功能描述:ESD Suppressor TVS 20KV 3-Pin TSFP T/R 制造商:Infineon Technologies AG 功能描述:TVS DIODES - Tape and Reel 制造商:Infineon Technologies 功能描述:Infineon Technologies ESD5V3U2U03FH6327XTSA1 ESD Suppressors 制造商:Infineon Technologies AG 功能描述:DIODE ESD ARRAY 5.3V TSFP-3
ESD5V3U2U-03LRH 制造商:Rochester Electronics LLC 功能描述: 制造商:Infineon Technologies AG 功能描述: